Profile Strip

Main materials

Solid: AgCu, AgCuZnNI, AgAuPdPt, AgCuNi, AgCuPd, AgCuIn, etc.

Composite:

(1) surface layer: Au, AuAg, AgPd, AuAgPd, AgCuNi etc.

(2) middle layer:Ag, AgPd, AgNI, AuAg etc.

(3) base layer: Cu, CuNi, BZn, Fe etc.

Characteristics

Profiled strip is developed to meet the requirements of electronic and electrical products for miniaturization, sensitivity and integration.

It has the following merits:

-Comprehensive advantages of various materials, applicable for multiple performance requirement.

-Good bonding strength, precise dimension, smooth surface and high wear resistance.

-Weldable through spot welding with decent positioning and appearance as well as high electromechanical stability.